Submissions open for 2014 APPMA scholarship

Submissions are now open for the 6th annual APPMA scholarship. Presented by the Australian Packaging and Processing Machinery Association (APPMA) and the Australian Institute of Packaging (AIP), the scholarship gives a packaging engineer the opportunity to complete a Diploma in Packaging Technology. The scholarship is valued at more than $9000.

An internationally recognised Level 5 foundation degree qualification, the Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level throughout the supply chain. The qualification is comprehensive and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.

Jamie Schellebeck MAIP, who won the 2013 scholarship, is a Packaging Engineer at Amcor Fibre Packaging.

“Winning the scholarship in 2013 was a wonderful opportunity for me and I am eager to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology. I look forward to graduating from the course in a few years,” Schellebeck said.

“The Diploma in Packaging Technology is an internationally recognised degree that will provide exemplary skills to graduates and we commend the APPMA for their long-term commitment to educational growth within the packaging industry. We encourage all packaging engineers in Australia to apply,” said Ralph Moyle MAIP, National President of the AIP.

Application forms are now available for the APPMA 2014 Scholarship program and can be accessed by emailing appma@appma.com.au or info@aipack.com.au or visiting either www.appma.com.au or www.aipack.com.au.

Submissions must be received by close of business on Friday 11 April. The 2014 winner will be announced as a part of Packaging & Processing Week which will be held alongside the AIP National Conference on 17 and 18 June