APPMA accepting submissions for 2014 scholarship program
The Australian Packaging and Processing Machinery Association (APPMA) is now accepting submissions for the 6th Annual APPMA Scholarship. The scholarship offers a packaging engineer the opportunity to complete a Diploma in Packaging Technology, worth more than $9000.
The internationally recognised Level 5 foundation degree qualification prepares students to take responsibility for packaging operations at any level throughout the supply chain.
“The APPMA has been offering this educational program now for six years and we have been very pleased with the calibre of winners, all of whom are busy completing their diplomas as we speak,” said Mark Dingley, chairman of the APPMA.
“Winning the scholarship in 2013 was a wonderful opportunity for me and I am eager to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology. I look forward to graduating from the course in a few years,” said Jamie Schellebeck MAIP, who won the 2013 scholarship. Schellebeck is a packaging engineer at Amcor Fibre Packaging.
The scholarship is offered by the APPMA in conjunction with the Australian Institute of Packaging (AIP).
Submissions must be received by close of business on Friday 11 April. The 2014 winner will be announced as part of Packaging & Processing Week, held alongside the AIP National Conference on 17 and 18 June at the Sofitel Sydney.
Application forms are available from www.appma.com.au or www.aipack.com.au, or by emailing appma@appma.com.au or info@aipack.com.au.
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