2010 APMA scholarship submissions now open

The Australian Packaging Machinery Association, in conjunction with the Australian Institute of Packaging, has announced that submissions are open for the second annual scholarship program, which will enable a packaging engineer to complete a Diploma in Packaging Technology.

The 2009 winner was Rebecca Du AAIP, who is a packaging engineer at Amcor Fibre Packaging. Rebecca commenced the Diploma in late 2009.

The Australian Packaging Machinery Association - Australia’s national organisation representing the packaging and processing machinery industry - believes that the scholarship program is not only an opportunity for a packaging engineer to further their education in the field of packaging, it also allows associations like theirs to contribute to the industry.

According to Rob Lawrence, Chairman of the Australian Packaging Machinery Association, “The annual scholarship enables the awardee to enrol in the Australian Institute of Packaging Diploma in Packaging Technology; an internationally recognised and accredited course.”

The Diploma in Packaging Technology has been offered by the AIP continuously since 1980 and is now offered online. The qualification is broad and provides an opportunity to study the principles of packaging, packaging materials and packaging processes. The Diploma is a degree-level qualification that prepares students to take responsibility for packaging operations at any level through the supply chain.

Entries are now invited for the Australian Packaging Machinery Association 2010 Scholarship program and information is available by emailing info@aipack.com.au or visiting www.aipack.com.au and clicking on the scholarship page.

Submissions must be received by close of business on Friday 30 April with the 2010 winner being announced at the AIP National Conference, to be held on 16 and 17 June at the Melbourne Cricket Ground, Victoria.